Features:
LY IR8500 Rework station for laptop motherboards, desktop computer motherboards, server boards, industrial computer boards, all kinds of game boards, communications equipment motherboards, LCD TVs and other large circuit board BGA rework.
LY IR8500 innovative designs an effective solution to general of infrared rework station vulnerable to the impact of air flow. will lead an inaccurate of temperature control can easily deal with lead-free soldering rework.
Specifications:
Basic Parameters | |
Zones | 2 |
Heating | IR |
Operations | Manual / Software |
Dimension | L780mmx W450mmx H260mm |
Weight | 18kg |
Total weight | About 21 kg, vary with the different need of the users |
Electrical Parameters | |
Power | 220V AC |
Upper Heating | IR |
Size of Upper heating | 80mm x 80mm |
Consumption of upper heating | 450W |
Bottom Heating | IR |
Size of Bottom heating | 400mm x200mm |
Consumption of Bottom heating | 1600W |
General power | 2050W |
Temperature Control | |
Control mode of Upper | Independent temperature control, high-precision closed-loop |
control, precision ± 0.5%, Alarm | |
Control mode of Bottom | Independent temperature control, high-precision closed-loop |
control, precision ± 0.5%, NO Alarm | |
Rework Function | |
SMD |
Suit for welding, remove or repair packaged devices |
such as BGA,PBGA,CSP,multi-layer substrates, EMI |
|
metallic shield product and solder/lead free Rework welding |
|
Size of applicable chips | ≤70mm x70 mm |
Size of applicable PCB | ≤400mm x305mm |
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